Morgan Tribolet

Morgan joined Intel in 2005 as a Package Engineer and has spent her career designing and developing Client and Datacenter products and transferring their process to high volume assembly sites. Most recently she lead the launch of Intel’s high performance computing GPU, Ponte Vecchio. She is a pioneer in the development of Intel’s wafer stacking technology, ramping their chip to wafer capabilities and extending the technology envelope to be one of the most advanced and competitive packaging companies in the world.  She strives to be a leader and champion for women in engineering.