Greg Anderson

Greg joined Intel in 2001 as a photolithography engineer and has held various engineering and management roles across Intel’s manufacturing ecosystem from the front-end of wafer fabrication to final product assembly and test. Most recently Greg launched Intel’s first high-volume wafer assembly facility enabling three-dimensional stacking of silicon components from various sources. Greg has led numerous starts-ups and capacity expansions over his career and is currently leading the creation of the first advanced semiconductor assembly and test facility in Europe, near Wrocław. He aspires to create a workforce that includes 50% women and inspire the next generation to pursue careers in technology.